Visit Dansensor at Interpack 2014
Dansensor will be exhibiting at Interpack, the leading processes and packaging trade fair, in Düsseldorf Germany, in May 2014.
We will be exhibiting together with MOCON - introducing our entire product range.
Experience our brand new and very modern stand.
You are welcome to contact us for an appointment on our stand before you go to Interpack.
Visit us for a MAP talk and see what's cooking in MAP technology:
Interpack, 8-14 May 2014
Düsseldorf, Germany
Dansensor stand: 5J03, hall 5